Evolution of MEMS Motion Sensor Technology in China and The United States based on Patent Citation Network
From the Perspective of Technology Life Cycle
DOI:
https://doi.org/10.6919/ICJE.202411_10(11).0003Keywords:
S-curve; Technology Life Cycle; Citation Network; Main Path.Abstract
Utilizing patent information related to MEMS motion sensors, this study employs the Logistic model to fit an S-curve for delineating the technology life cycle of MEMS motion sensor technology. It identifies the top two Chinese and American patents globally based on application volume and conducts a macro comparison between high-citation, high-value star patents from both countries. By applying the Search Path Counts (SPC) algorithm, we extract the primary trajectory of MEMS motion sensors in China and the US, subsequently proposing a technique evolution mapping method that integrates this main path with citation networks. This allows for a comparative analysis of technological trajectories between China and the US, culminating in constructive recommendations aimed at universities, enterprises, and other innovative entities within our country.
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