Evolution of MEMS Motion Sensor Technology in China and The United States based on Patent Citation Network

From the Perspective of Technology Life Cycle

Authors

  • Fang Huang

DOI:

https://doi.org/10.6919/ICJE.202411_10(11).0003

Keywords:

S-curve; Technology Life Cycle; Citation Network; Main Path.

Abstract

Utilizing patent information related to MEMS motion sensors, this study employs the Logistic model to fit an S-curve for delineating the technology life cycle of MEMS motion sensor technology. It identifies the top two Chinese and American patents globally based on application volume and conducts a macro comparison between high-citation, high-value star patents from both countries. By applying the Search Path Counts (SPC) algorithm, we extract the primary trajectory of MEMS motion sensors in China and the US, subsequently proposing a technique evolution mapping method that integrates this main path with citation networks. This allows for a comparative analysis of technological trajectories between China and the US, culminating in constructive recommendations aimed at universities, enterprises, and other innovative entities within our country.

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Published

2024-10-17

Issue

Section

Articles

How to Cite

Huang, Fang. 2024. “Evolution of MEMS Motion Sensor Technology in China and The United States Based on Patent Citation Network: From the Perspective of Technology Life Cycle”. International Core Journal of Engineering 10 (11): 12-22. https://doi.org/10.6919/ICJE.202411_10(11).0003.