Research Progress in Packaging Technology of MEMS Inertial Navigation Micro-system

Shijun Shen; Yaqi Xu; Guizhou Yu; Wei Ding; Yonghe Zhuang

doi:10.6911/WSRJ.202501_11(1).0003

Authors

Shijun Shen
Yaqi Xu
Guizhou Yu
Wei Ding
Yonghe Zhuang

DOI:

https://doi.org/10.6911/WSRJ.202501_11(1).0003

Keywords:

MEMS inertial navigation micro-system; Micro Inertial Measurement Unit(MIMU); 3D integration technology; Through Silicon Via(TSV).

Abstract

As the demand for ultra small Micro-Electro-Mechanical System(MEMS) inertial navigation microsystems in intelligent micro air vehicles becomes increasingly urgent, DARPA is investing heavily in the development of Micro Inertial Measurement Unit (MIMU) to enable inertial navigation systems to have higher integration, smaller size, lower power consumption, and lower cost. This article introduces the three-dimensional integration technology of MEMS inertial navigation microsystems, system packaging architecture design, and Through Silicon Via(TSV) vertical interconnect technology of MEMS chips. It analyzes and studies the ways and future development directions of three-dimensional integration of MIMU inertial navigation systems, and proposes solutions and paths to significantly improve the integration degree of MEMS inertial navigation systems.

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